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4 Layer ENIG Earphone Circuit Board SMD PCB Assembly

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4 Layer ENIG Earphone Circuit Board SMD PCB Assembly

Brand Name : JIETENG

Model Number : Rogers FR4

Certification : ISO/TS16949/RoHS/TS16949

Place of Origin : Guangdong, China

MOQ : Negotiable

Price : Negotiable

Payment Terms : Negotiable

Supply Ability : 150000 Square Meter/Square Meters per Year

Delivery Time : 5-8 days delivery

Packaging Details : Vacuum packing in blank cartons

Min Hole Size(mechanical) : 0.2mm

Hole Position Tol : ±0.075mm

Solder mask : Green, Blue, Black

Silk screen : White, Black

Acceptable File Format : Gerber file,Powerpcb,CAD,AUTOCAD,ORCAD,P-CAD,CAM-350,CAM2000

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Essential details
Model Number:
PCB
Place of Origin:
Guangdong, China
Base Material:
FR4
Copper Thickness:
12um--70um
Board Thickness:
0.05-0.75mm
Min. Hole Size:
0.1mm
Min. Line Width:
±0.05mm
Min. Line Spacing:
±0.05mm
Surface Finishing:
OSP,ENIG,Immersion Tin,Immersion silver
Solder mask color:
Yellow,Black,white,Green,Red,Blue
Silkscreen color:
white/black
Assembly Service:
SMD/DIP/BGA/COB component assembly

Products Description
Seq
Item
Standard
Special
1
Production Capability
Single-sided:20,000M²/Month
N/A
Double-sided/Multi-layers:10,000M²/Month
N/A
2
Base Material
Polyimide ( PI )
Polyester (PET)
3
Layers
Flexible Printed Circuit(FPC) Board:1~6layers
8Layer
Rigid-Flex Board:2~6layers
8Layer
4
Maximum Size
250*1200mm
500*1200mm
5
Maximum Thickness
0.75mm
N/A
6
Minumum Thickness
0.05mm
N/A
7
Product thickness tolerance
± 0.03mm
± 0.02mm
8
Copper Thickness
12um (1/3OZ),18um (1/2OZ) , 35um (1OZ), 70um (2oz)
6um(1/4OZ), 140um (4OZ)
9
Minimum Line Width/ Distance between stitchings
± 0.05mm
± 0.03mm
10
Stiffener material type
PI / FR4 / PET / Steel piece
N/A
11
Etching tolerance
± 0.02mm
N/A
12
Minimum Hole Diameter
0.1mm
N/A
13
Hole tolerance
PTH: +/- 0.05mm
NPTH: +/-0.03mm
N/A
14
Outline profile
Punching , Laser cut
N/A
15
Outline Dimension tolerance
± 0.1mm
± 0.05mm
16
Solder mask color
Yellow,Black,white
Green,Red,Blue
17
Surface treatment
OSP: 0.2-0.5um
ENIG: Au 0.03um - 0.15um
Immersion Tin:0.5-1.5um
Immersion silver: 0.1-1.2um
Gold plating: Au 1-150U’’
HASL : 1- 20um
18
Thermal shock test
288 ± 5 ℃ , 10S , 3times
N/A
19
Environmental Requirement
ROHS
N/A

4 Layer ENIG Earphone Circuit Board SMD PCB Assembly


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